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Unreliable electrical tests: Electrical tests run a current through the PCB to ensure it is electrically sound.Inspections help experts catch these defects so they can avoid sending out faulty parts. Both the density of connections and the difficulty of soldering mean there is a high likelihood of a defect occurring. Soldering difficulty: Soldering BGA components is tricky, as it requires sufficient heat to be applied to the array so all balls in the grid melt sufficiently to make solder joints.Despite this difficulty, inspection is essential for BGAs for several reasons, including: Because of this feature’s positioning, it can be challenging to get a good view of the BGA for inspection. The components of these techniques will be discussed in greater detail further along in this article.īGA inspection is notoriously difficult for one reason - the solder joints are located beneath the BGA package. These analysis methods include electrical testing, assisted optical inspection and X-ray inspection. BGA inspections look at various aspects of the ball grid array, including the package’s standoff height, the quality of the connections and more. In BGA inspections, unassisted visual inspection is extremely limited, so other techniques are required to get a detailed look at the connections. This is where BGA inspection plays a vital role.īGA inspection is a process where the connections between a chip and a PCB are analyzed to ensure quality. Because they are not visible, more advanced inspection techniques are required to ensure their quality. Once the solder connections are complete, however, they are no longer visible to the casual observer. These connections need to be carefully soldered due to their location underneath the package. Instead of being wire pins, these connections are made with pads with balls of solder. The BGA’s bottom surface is covered in pins arranged in a grid pattern, hence the technology’s name. In this article, we’ll discuss the challenges of BGA inspection, inspection techniques used in BGA quality control and ways to avoid common BGA defects before assembly.Ī ball grid array is a surface-mount package for integrated circuits that is used to mount devices. However, these devices are notoriously difficult to inspect after assembly.
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This push led to the development of ball grid array (BGA) technology.īGA and similar devices have quickly become a standard element in modern printed circuit board ( PCB) design. However, increased demand for these products also required the development of high-density technologies that could be quickly assembled. To keep up with these consumer desires, surface-mount technology (SMT) was introduced. The constant progress of technology has moved electronics toward small, lightweight products.